Product Features:
- Thermal Conductivity: 1.0W/m.k
- Tasteless, Non-corrosive, Non-toxic: Environmentally friendly
- Low Thermal Resistance: High-temperature resistance, non-powdering, good thermal conductivity
- Application: Reduces the operating temperature of various heating elements, high-power bipolar junction transistors, fills gaps between SCR (thyristor), diode (transistor), and the substrate (aluminum, copper), as well as between CPU and radiator.
Operating Instructions:
- Preparation: It’s recommended to pre-mix the product if it has been left unused for an extended period. Confirm compatibility with the material by conducting a sample test before application.
- Cleaning the Surface: Clean the surface to be coated to remove oil stains.
- Gluing: For smoother gluing, stir for 2 minutes before application. Ensure a consistent and gap-filling layer on the coated surface.
- Storage: Avoid prolonged exposure to air.
Storage Conditions:
- Store in a cool and dry place below 35°C.
- Shelf Life: 12 months
Attentions:
- Keep away from children.
- It is recommended to use it in a well-ventilated area to reduce odors.
- If it accidentally comes into contact with the skin or eyes, wipe them clean immediately, then rinse with water and seek medical advice.
- For safety information, please refer to the Material Safety Data Sheet (MSDS).
Packaging Specifications:
- 1kg / piece, 12 pieces / Carton
- 300ml / piece, 24 pieces / Carton
- 2600ml / piece, 4 pieces / Carton
Special Note:
The data in this manual were obtained under laboratory conditions. Due to differences in usage environments, users should use these data and conditions for analysis and testing. Vinisili does not guarantee the product’s performance or its use under specific operating conditions and assumes no liability for direct, indirect, or accidental losses. If you encounter any problems during use, please contact the Vinisili technical service department for assistance.
